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美股
詳情
本頁面由Tiger Trade Technology Pte. Ltd.提供服務
Corgi AMKR 2x Daily ETF
10.73
+0.8418
8.51%
盤後：
10.63
-0.0993
-0.93%
16:10 EDT
成交量：
1,120
成交額：
1.19萬
市值：
21.46萬
市盈率：
- -
高：
10.73
開：
10.40
低：
10.40
收：
9.89
52周最高：
25.51
52周最低：
8.19
股本：
2.00萬
流通股本：
2.00萬
量比：
0.68
換手率：
5.60%
股息：
- -
股息率：
- -
淨資產收益率：
--
總資產收益率：
--
市淨率：
--
市盈率(LYR):
- -
資料載入中...
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公司
新聞
公告
費城半導體指數日內跌3%
智通财经
·
08/28
費城半導體指數日內跌2%
智通财经
·
08/28
出口管制"穿透時代"來臨：海關申報新規與 BIS 股權規則雙線收緊
同花顺
·
08/28
SK海力士在美舉行HBM先進封裝廠動工儀式
第一财经
·
08/28
SK海力士(SKHY.US)美國首座HBM先進封裝基地正式動工 投資逾40億美元 2029年啓動量產
智通财经
·
08/27
費城半導體指數升逾2%，報11871.31點。
格隆汇
·
08/27
費城半導體指數日內漲2%
智通财经
·
08/27
中金：玻璃基板有望成下一代先進封裝的重要材料平台 相關核心設備環節或率先受益
智通财经
·
08/27
費城半導體指數日內漲2%
智通财经
·
08/25
A股全天縮量調整 深成指收跌0.35% 能源金屬、先進封裝板塊走低
金吾财讯
·
08/25
費城半導體指數下跌3.8%，觸及三周低點。
智通财经
·
08/24
美股異動 | 半導體板塊集體走低 費城半導體指數跌超3.5%
智通财经
·
08/24
費城半導體指數跌幅擴大至4%
格隆汇
·
08/24
費城半導體指數日內跌4%
智通财经
·
08/24
費城半導體指數日內跌3%
智通财经
·
08/24
費城半導體指數日內跌2%
智通财经
·
08/24
SK海力士新一代HBM引入先進封裝技術
格隆汇
·
08/24
SK海力士正在為其下一代HBM方案引入先進封裝技術
智通财经
·
08/24
費城半導體指數下跌1.05%，現報11675點。
格隆汇
·
08/21
費城半導體指數開盤漲1%，報11929.87點。
格隆汇
·
08/21
更多
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21:32","pubTimestamp":1787837564,"startTime":"0","endTime":"0","summary":null,"market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["ONG","AMDC","TSXD","AMDL","AMDW","SOXW","TSMU","DAMD","TSMX","TSMY","SEMY","AMYY","TSMG","SOX","AMDY","ONX","AMKL","TWSC","XSEM","AMUU","AMDG","AMDD","STSM","TSMZ","AMKX","TSXU"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662308803","title":"費城半導體指數日內漲2%","url":"https://stock-news.laohu8.com/highlight/detail?id=2662308803","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2662308803?lang=zh_tw&edition=fundamental","pubTime":"2026-08-27 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07:43","pubTimestamp":1787787802,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，中金发布研报称，随着AI大芯片封装尺寸升级，玻璃基板有望成为下一代先进封装的重要材料平台，相关核心设备环节有望率先受益。中金主要观点如下：玻璃基板正处于“从0到1”阶段，核心场景为先进封装，成长潜力高。玻璃基板至2030年设备累计空间近500亿元，远期渗透率打开有望达千亿元。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1486668.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["TCAI","AMKX","BESIY","AMKL","DRMP","BK4147","HBMX"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662305197","title":"費城半導體指數日內漲2%","url":"https://stock-news.laohu8.com/highlight/detail?id=2662305197","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2662305197?lang=zh_tw&edition=fundamental","pubTime":"2026-08-25 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