Shares of the CSOP SK hynix Daily (2x) Leveraged Product (07709) climbed nearly 6% during Wednesday's trading session, surging 5.88% to HK$38.80 with turnover reaching HK$1.748 billion.

Market sentiment was fueled by reports that SK hynix is in discussions with Intel regarding a potential collaboration to manufacture memory chips on US soil. According to the reports, the potential agreements being considered include leasing a portion of Intel's Ohio chip fabrication facility or establishing a joint venture alongside Intel and major cloud computing firms.

The negotiations are still in an exploratory phase, with no definitive decisions made yet. Reports indicate that if advanced memory technologies such as DRAM or High Bandwidth Memory (HBM) are involved, the deal could potentially face scrutiny from the South Korean government.

SK hynix stated that it is evaluating multiple options, including the addition of new production bases, but no specific plans have been finalized at this time. Meanwhile, Intel affirmed its continued commitment to investing in the development of its Ohio facility.